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i-boot, stored in the chip's internal mask ROM, plays a crucial role in the system's initialization process. During power-on reset, the program counters of all four ARM Cortex A55 CPUs are configured to point to the entry point address of i-boot. Upon the completion of power-on reset, the CPUs commence execution from this entry point. i-boot undertakes a series of essential tasks, including CPU initialization, setting up interrupt vectors, stack initialization, cache setup, serial port configuration, timer configuration, and more.

Following this initialization phase, i-boot loads x-boot from external storage devices into SRAM and performs a checksum verification. If the verification passes, i-boot proceeds to execute x-boot.

Table of Contents

Key features of i-boot

  1. Output log at UART0 with a baud rate of 115,200 bps.

  2. UART0 pins can be turned off through an OTP bit.

  3. Read bootstrap pins IV_MX[6..3] to decide boot-device.

  4. Support for five boot devices: SPI-NOR flash, SPI-NAND flash, 8-bit NAND flash, eMMC, SD card, and USB flash drive (on either USB2.0 or USB3.0 port).

  5. Implementation of secure-boot with the ability to verify the digital signature of the x-boot image and decrypt it.

  6. Secure-boot activation controlled by an OTP bit.

  7. Support for warm-boot, enabling wake-up from deep-sleep mode.

  8. Support for the peripheral-reset signal (output from G_MX2).

Main flow

The i-boot flow initiates with the reset vector, followed by the execution of the "cpu_init" subroutine responsible for initializing the CPU. Next in the sequence is the "start_boot" subroutine, which sets up the C execution environment. The flow then advances to execute the "iboot_main" subroutine, serving as the C main function within i-boot.

image-20240125-054441.png

The "iboot_main" subroutine commences by invoking the "init_cdata" subroutine to initialize global C data. It then proceeds to read boot-strap pins from a dedicated hardware register, storing the information in the C structure g_bootinfo. In the event of a warm-boot scenario, it checks the readiness of DRAM (where CM4 handles the restoration of DDR IO retention data and specific hardware registers or settings). If DRAM is confirmed ready, the subroutine redirects to the start address of the warm-boot module to continue the warm-boot processes.

In cases where a warm-boot is not applicable (in cold-start scenario), the process continues to execute the "AV1_STC_init()", "init_uart()", and "init_hw()" subroutines to initialize hardware components. Finally, it advances to run the "boot_flow()" subroutine.

image-20240125-053602.png

The "boot_flow()" subroutine begins by examining the C structure g_bootinfo to determine the preferred boot device: eMMC, SPI-NAND flash, 8-bit NAND flash, SD card, or USB flash drive. It then initializes the controller of the selected boot device and loads the x-boot image into SRAM from the chosen source. After loading, the subroutine checks the image checksum. If the checksum passes verification, it proceeds to execute x-boot.

In the case of secure-boot activation through OTP bits, the subroutine additionally checks the digital signature and decrypts the image after the checksum validation.

It's essential to note that i-boot does not initialize DDR DRAM, rendering it temporarily unavailable. Hence, x-boot must be loaded into SRAM for execution.

image-20240125-111010.png

Boot devices

i-Boot supports five boot devices, each with specific specifications and requirements. Below is a detailed table outlining the specifications for each boot device:

Boot devices

Specifications

8-bit NAND

flash

  1. The first block should contain Sunplus Boot Profile Header.

  2. x-boot image should be stored in 1K60 ECC sectors.

  3. x-boot image should be stored in 1K60 ECC sectors.

  4. Set read cycle-time to 240 nS.

  5. GPIO82 set to HIGH for 3.0V NAND flash, LOW for 1.8V NAND flash.

eMMC device

  1. x-boot image should be stored at Boot Area Partition 1.

  2. Set bus clock to 25 MHz.

  3. GPIO82 set to HIGH for 3.0V IO power, LOW for 1.8V IO power.

SPI-NAND flash

  1. First block should contain Sunplus Boot Profile Header.

  2. x-boot image should be stored in 1K60 ECC sectors.

  3. Support for X1 and X2 positions. Attempt X1 position first and then proceed to X2 position.

  4. Set bus clock to 11.2 MHz.

  5. GPIO82 set to HIGH for 3.0V SPI-NAND flash, LOW for 1.8V SPI-NAND flash.

SPI-NOR flash

  1. x-boot image should be stored at offset 0x18000 (96KiB).

  2. Set bus clock to 11.2 MHz.

  3. GPIO82 set to HIGH for 3.0V SPI-NOR flash, LOW for 1.8V SPI-NOR.

SD card

  1. x-boot image should be stored at offset 0 of the file ISPBOOOT.BIN.

  2. ISPBOOOT.BIN should be stored in the root directory of the first or sole partition of the SD card.

  3. The partition should be formatted to FAT32 or FAT16 file-system.

  4. Set bus clock to 5 MHz.

USB flash drive

  1. x-boot image should be stored at offset 0 of the file ISPBOOOT.BIN.

  2. ISPBOOOT.BIN should be stored in the root directory of first or sole partition of the USB flash drive.

  3. The partition should be formatted to FAT32 or FAT16 file-system.

  4. Support high-speed only

  5. Support USB flash drive on both USB2.0 or USB3.0 ports. Attempt USB3.0 port first and then proceed to USB2.0 port.

Boot core and other cores

CPU core 0 serves as the boot core, responsible for all boot processes from i-boot to Linux. Meanwhile, CPU core 1, 2, and 3 enter a spin state (wfe mode) inside i-boot after initialize itself, awaiting activation by core 0. The following assembly shows the processes.

image-20240122-034050.pngImage Removedimage-20240125-142815.pngImage Added

Run Control of CPU (at bootcompat session) :

image-20240122-034202.png

CPU_WAIT_INIT_VAL (0xffffffff)    // CPU waiting (spinning)

CPU_WAIT_A64_VAL (0xfffffffe)    // CPU goes to A64

x (address other than above)    // CPU goes to x

Bootstrap pins of SP7350

The state of bootstrap pins of SP7350 is read into bootstrap register (G0.31) upon releasing power-on reset. Refer to definition of boot-strap pins in i-boot below:

Boot-strap pins of SP7350

Boot devices

MX6

MX5

MX4

MX3

MX2

MX1

MX0

1

1

1

1

1

x

x

eMMC boot

1

1

1

0

1

x

x

SPI-NAND boot

1

1

0

1

1

x

x

USB boot

1

1

0

0

1

x

x

SDC boot

1

0

1

1

1

x

x

SPI-NOR boot

1

0

0

0

1

x

x

8-bit NAND boot

Note:

  1. If MX1 = 0, the JTAG interface of CA55 of SP7350 will be enabled.

  2. If MX2 = 0, SP7350 will enter test mode. Always set to 1 for normal operation.