SP7350 Specification
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Table of Contents
- 1 1. Introduction
- 2 2. Features
- 3 3. Power Domains
- 4 4. CPU, MCU, NPU and DRAM Interface
- 4.1 4.1 CPU
- 4.2 4.2 NPU
- 4.3 4.3 MCU
- 4.4 4.4 DRAM Interface
- 5 5. Boot Devices and In-System Programming
- 6 6. USB Interfaces
- 7 7. Ethernet Controller
- 8 8. MIPI Interfaces and Display
- 8.1 8.1 MIPI CSI RX
- 8.2 8.2 MIPI CSI/DSI TX
- 8.2.1 8.2.1 MIPI DSI TX
- 8.2.2 8.2.2 MIPI CSI TX
- 8.3 8.3 Display Engine
- 9 9. Image and Video Codec
- 10 10. Audio Interface
- 10.1 10.1 Channel 0
- 10.2 10.2 Channel 1
- 10.3 10.3 Channel 2
- 10.4 10.4 Clock for external ADC or DAC
- 10.5 10.5 TDM
- 10.6 10.6 SPDIF
- 11 11. Analog-Digital Converter
- 12 12. UART, SPI and I2C
- 13 13. RTC, STC, PWM and Clock Generators
- 14 14. GPIO
- 15 15 Recommended Operating Conditions
- 16 16 Electric Characteristics
- 16.1 16.1 Absolute Maximum Ratings
- 16.2 16.2 Thermal Information
- 16.3 16.3 ESD Ratings
- 16.4 16.4 DC Characteristics
- 16.4.1 16.4.1 3.0/1.8V DVIO Specification (3.0V Mode)
- 16.4.2 16.4.2 3.0/1.8V DVIO Specification (1.8V Mode)
- 16.4.3 16.4.3 1.8V GPIO Specification
- 16.4.4 16.4.4 25MHz Crystal XIN Specification
- 16.4.5 16.4.5 32.678kHz Crystal XIN Specification
- 16.4.6 16.4.6 SAR ADC Specification
- 16.4.7 16.4.7 Thermal Sensor Specification
- 16.4.8 16.4.8 USB2.0 PHY Specification
- 16.4.8.1 16.4.8.1 Transmitter
- 16.4.8.2 16.4.8.2 Receiver
- 16.4.9 16.4.9 USB3.1 PHY Specification