Skip to end of metadata
Go to start of metadata

You are viewing an old version of this page. View the current version.

Compare with Current View Page History

« Previous Version 3 Next »

A built-in ROM code.

Load x-boot image from a boot storage device into SRAM and run it.

Support 6 boot storage devices:

SPI-NOR flash, SPI-NAND flash, 8-bit NAND flash, eMMC, SD card

USB2.0 and USB3.0 flash drives

Support secure-boot.

Support encrypted x-boot.

CPU core 0 is the boot-core and is responsible for booting.

CPU core 1, 2 and 3 spin at i-boot until being waked up.

Support warm-boot (wake up from deep-sleep mode).

CPU core 0 is the boot core.

CPU core 0 is responsible for all boot processes from i-boot to Linux.

CPU core 1, 2 and 3 spin (enter wfe mode) after initialize itself at i-boot.

image-20240122-034028.png

image-20240122-034050.png

Run Control of CPU Pen (at bootcompat session) :

image-20240122-034202.png

CPU_WAIT_INIT_VAL (0xffffffff)    // CPU waiting (spinning)

CPU_WAIT_A64_VAL (0xfffffffe)    // CPU goes to A64

x (address other than above)    // CPU goes to x

Bootstrap pins of SP7350

State of bootstrap pins of SP7350 will be read into bootstrap register (G0.31) at the moment that power-on reset is released. Refer to definition of boot-strap pins of SP7350 below:

Boot-strap pins of SP7350

Boot devices

MX6

MX5

MX4

MX3

MX2

MX1

MX0

1

1

1

1

1

x

x

eMMC boot

1

1

1

0

1

x

x

SPI-NAND boot

1

1

0

1

1

x

x

USB boot

1

1

0

0

1

x

x

SDC boot

1

0

1

1

1

x

x

SPI-NOR

1

0

0

0

1

x

x

8-bit NAND

Note:

  1. If MX1 = 0, JTAG interface of CA55 of SP7350 will be enabled.

  2. If MX2 = 0, SP7350 will enter test mode. Always set to 1 for normal operation.

Add label

  • No labels