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  • CPU: Quad ARM Cortex-A55

    • 1.8 GHz (2.1 GHz for specific components)

    • Cache

      • L1 Cache: 32kB I-cache / 32kB D-cache

      • L2 Cache: 128kB

      • L3 Cache: 1MB

    • Support NEON advance SIMD architecture & Floating-point

    • Support DVFS

      • 0.5GHz ~1.5GHz @0.8V 85°C

      • 1.5GHz ~1.8GHz @TT 0.84V 85°C

      • 1.5GHz ~1.8GHz @SS 0.94V 85°C

    • Support individual core power down

    • Support 2/4 core configurable by e-fuse (OTP)

    • Support maximum frequency limited by e-fuse (OTP)

      • Maximum limited to 1.5GHz, 1.8GHz, and 2.1 GHz

    • Support Coresight debug solution

      • JTAG interface

      • CTI and PMU

      • ETB: 1k to 4k bytes buffer size per core

  • NPU: AI and Parallel Processing Engine

    • Verisilicon VIP9000DI, with 256kB SRAM

    • Up to 4.5 TOPS (@900MHz) computing power

    • Support configurable operating frequency

    • Support indivudual controllable power domain.

    • Support OpenCL and OpenVX with Neural Network Extension

  • MCU: ARM Cortex-M4

    • Support FPU

    • Support 400MHz, 200MHz, 100MHz and 25MHz

    • Support JTAG and SWD interface

  • DDR SDRAM

    • LPDDR4-3200, DDR4-3200, DDR3-1866

    • 2 channels, 16 bits per channel

    • Up to 8GB memory capacity

    • Support IO retention

  • Internal SRAM

    • 256kB at main power domain

    • 384kB at CM4 (AO) power domain

      • For CM4 operation and DRAM IO retention data

  • AXI DMA

    • Support 16 channels

    • Support memory-to-memory copy

    • Support hardware handshake for 8-bit NAND controller

  • AHB DMA

    • Support 16 channels

    • Support memory-to-memory copy

    • Support hardware handshake for I2C and SPI controllers

  • Boot Devices

    • eMMC devicce

      • Support both 1.8V and 3.3V IOVDD

      • Support SDR up to 200 MHz (only for IOVDD = 1.8V)

      • Support DDR up to 160 MHz (only for IOVDD = 1.8V)

    • SD card

      • Support SD 3.0

      • Support SDR up to 200MHz

    • SPI-NAND flash

      • Support SLC NAND only

      • Support up to 150Mz (only for 1.8V)

      • Support 1 or 2 planes 2k page-size dice

      • Support 1 plane 4k page-size dice

    • 8-bit NAND flash

      • Support 1.8V and 3.3V

      • Support 2k/4k/8 page-size dice

      • Support synchronous mode

    • SPI-NOR flash

      • Support 1/2/4-bit mode

      • Support 1.8V and 3.3V

      • Support up to 100Mz (only for 1.8V)

  • In-system Programming for Flash Devices

    • eMMC, SPI-NAND, 8-bit NAND, and SPI-NOR

    • In-system programming through USB flash drives or SD cards

  • Security

    • Support AES-128/192/256 encryption and decryption ECB, CBC, CTR mode

    • Support RSA

      • 256/512/1024/2048 bits encryption

      • modular exponentiation

    • Support HASH

      • SHA-2 256/512

      • SHA-3 224/256/384/512

      • MD5

    • GHASH for AES GCM mode

    • Support POLY 1305

    • Support Pseudo RNG

    • Support ARM TZC-400

    • Support secure boot

  • SDIO

    • Support SD 3.0

    • Support transfer rate up to 104MB/s (UHS-1)

  • Video and image codec

    • H.264/MVC, VP8 and JPEG encoding

    • H.264/SVC and JPEG decoding

    • Individual controllable power domain.

  • USB3.1 (Gen. 1) Interface

    • Compliant to USB 3.1 Gen1 with DRD

    • Data rate up to 5Gbps

    • Integrated PHY

    • Support 4 sets of end-points (1 control and 3 data)

  • USB2.0 Interface

    • Compliant to USB 2.0

    • Support OTG 1.0

    • Support High and Full speeds

      • 4 in: 3 bulk/interrupt; 1 bulk/interrupt/isochronous

      • 4 out: bulk/interrupt; 1 bulk/interrupt/isochronous

  • MIPI CSI RX

    • 1 MIPI-CSI2 RX 4D1C (1.5 Gbps per lane), support 4 virtual channel

    • 1 MIPI-CSI2 RX 2D1C (1.5 Gbps per lane), support 2 virtual channel

    • 2 MIPI-CSI2 RX 2D1C (1.5 Gbps per lane), support 2 virtual channel

      • Shared pins with CPIO (when CPIO disable, MIPI CSI RX enable)

      • 2 MIPI-CSI2 RX can be combined as 1 MIPI-CSI2 RX 4D1C, support 4 virtual channel

    • Max resolution: 2688x1944

  • MIPI CSI/DSI TX

    • One MIPI TX output for either CSI or DSI

    • 4 lanes with 1.5Gbps per lane

    • DSI TX resolution up to 1920x1080

    • CSI TX resolution up to 3840x2880

  • Audio Interfaces

    • One bidirectional I2S

    • Two unidirectional I2S

    • One 16-channel TDM

    • Configurable serial clock frequency

    • Support 16 bit audio format

    • Support both master and slave mode

    • Compliant with the IIS/PCM standard

  • Ethernet Controller

    • Support 10/100/1000 Mbps data rate

    • Support RGMII and RMII interface (1.8V)

    • Support IEEE1588

  • ADC

    • 12-bit SAR ADC with 4-channel

    • Sampling rate up to 1MHz

  • PWM

    • Support 12 bits resolution

    • Support pre-scaling factor from 1 to 512

  • Real-Time-Clock (RTC)

    • Independent Always-On power domain

    • 64 bits free-run timer with 32.768 kHz clock input

  • SPI/I2C/UART

    • Up to seven UART interfaces

    • Up to six SPI interfaces (5 master, and 1 slave)

    • Up to ten I2C interfaces

  • GPIO

    • Support total 106 GPIOs

    • Support software programmable driving strength for all GPIOs

    • Support 60 GPIOs with 1.8V/3.3V capability

      • 3 groups in AO-power domain

      • 2 groups in main-power domain

  • Watchdog Timer

    • 32-bit counter

    • Up to 223 second

  • Mailbox

    • For inter-processor communication between CA55 and CM4

  • RTC

    • 32.768 kHz crystal

  • Semaphore

    • Support read lock and write unlock

    • Support 16 channels

  • Thermal Sensor

    • Placed at between CPU and NPU

    • Support two threshold temperatures (default disable)

      • Alarm threshold, interrupt to CPU

      • Shutdown threshold, for resetting all system

  • Multi-Function Interface (MFI) and CPIO

    • Selectable proprietary CPIO and MIPI CSI-RX interfaces

    • CPIO interface

      • Supports 4 data lanes for both TX and RX, provides 1.0 GiB/s bandwidth

      • Support hardware auto calibration

      • Support hardware auto and/or software programmable SWAP and CROSSOVER modes

      • Support data swap

  • Package: 15x15mm2 FCCSP

3. Power Domains

The C3V-W architecture comprises six distinct power domains, each with its dedicated power supply that can be independently activated or deactivated. Illustrated in the figure below, these domains are: RTC, CM4 (AO), CA55, NPU, Video codec, and Main power domains.

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3.1 RTC Power Domain

The RTC power domain is typically powered by either a battery or a super capacitor. Its primary component is the real-time clock (RTC), which remains powered continuously to ensure uninterrupted operation. The RTC is driven by a 32.768 kHz crystal oscillator. Additionally, this domain includes circuitry for wake-up key detection. When the wake-up key is pressed for one second, activating the CM4_WAKEUP_KEY signal to HIGH, it triggers the enablement of power to the CM4 domain.

3.2 CM4 Power Domain

The CM4 power domain, also known as the Always On (AO) power domain, remains powered continuously, facilitating the operation of CM4 and its peripherals even when other domains like CA55 and the Main-power domain are powered down. Primarily, it manages the power flow for the CA55 and Main-power domains. CM4 possesses the capability to access all devices and peripherals within the Main-power domain even in the absence of power to the CA55.

In the current implementation, during normal operation, pressing the wake-up key for one second prompts CM4 to instruct Linux and CA55 to enter the suspend-to-RAM state (STR). While in STR state, pressing the wake-up key for 0.3 seconds triggers CM4 to instruct CA55 to restore to normal operational status.

3.3 CA55 Power Domain

The CA55 power domain encompasses four Cortex A55 cores along with their L1, L2, and L3 caches. It supports Dynamic Voltage and Frequency Scaling (DVFS). The entire CA55 cluster can be powered down, and each core within CA55 can be individually deactivated. Given that CA55 is connected to the AXI bus in the Main-power domain, its operation necessitates the activation of the Main-power domain.

3.4 Main-power Domain

The Main-power domain hosts the majority of the devices and peripherals within the C3V-W system. All components within this domain are interconnected via three AXI buses. Notably, while the DDR SDRAM controller and PHY reside in the Main-power domain, the IO buffer of the PHY and DDR SDRAM chip are positioned in the CM4 power domain. This configuration ensures that the SDRAM remains in a retention state when the Main-power domain is powered off.

3.5 NPU Power Domain

The NPU's power can be individually toggled off when not in use. However, given its connection to the AXI bus in the Main-power domain, operating the NPU requires the Main-power domain to be activated.

3.6 Video-codec Power Domain

Similar to the NPU, the power supply to the video codec can be individually deactivated when not in use. Nevertheless, the video codec's operation necessitates the activation of the Main-power domain due to its connection to the AXI bus within that domain.

4. CPU, MCU, NPU and DRAM Interface

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Channel

Data Lane #

Virtual Channel #

Remarks

RX0

2

2

Not available in this package

RX1

2

2

Not available in this package

RX2

2

2

RX3

2

2

RX4

2

2

RX5

4

4

It's important to note that RX2 and RX3 share pins with the CPIO interface. Therefore, only one of RX2/RX3 or the CPIO interface can be active at any given time.

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