Page Comparison

Disclaimer

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• CPU: Quad ARM Cortex-A55

  • 1.8 GHz (2.1 GHz for specific components)

  • Cache

    • L1 Cache: 32kB I-cache / 32kB D-cache

    • L2 Cache: 128kB

    • L3 Cache: 1MB

  • Support NEON advance SIMD architecture & Floating-point

  • Support DVFS

    • 0.5GHz ~1.8GHz for SP7350

    • 0.5GHz ~1.5GHz for SP7350L

  • Support individual core power down

  • Support 2/4 core configurable by e-fuse (OTP)

  • Support maximum frequency limited by e-fuse (OTP)

    • Maximum limited to 1.5GHz, 1.8GHz, and 2.1 GHz

  • Support Coresight debug solution

    • JTAG interface

    • CTI and PMU

    • ETB: 1k to 4k bytes buffer size per core

• NPU: AI and Parallel Processing Engine

  • Up to 4.1 TOPS (@900MHz) computing power

  • Support configurable operating frequency

  • Support individual controllable power domain.

  • Support OpenCL and OpenVX with Neural Network Extension

• MCU: ARM Cortex-M4

  • Support FPU

  • Support 400MHz, 200MHz, 100MHz and 25MHz

  • Support JTAG and SWD interface

• DDR SDRAM

  • LPDDR4-3200, DDR4-3200, LPDDR3/DDR3/DDR3L-1866

  • 2 channels, 16 bits per channel

  • Up to 8GB memory capacity

  • Support IO retention

• Internal SRAM

  • 256kB at main power domain

  • 384kB at CM4 (AO) power domain

    • For CM4 operation and DRAM IO retention data

• AXI DMA

  • Support 16 channels

  • Support memory-to-memory copy

  • Support hardware handshake for 8-bit NAND controller

• AHB DMA

  • Support 16 channels

  • Support memory-to-memory copy

  • Support hardware handshake for I2C and SPI controllers

• Boot Devices

  • eMMC device

    • Support both 1.8V and 3.3V IOVDD

    • Support SDR up to 200 MHz (only for IOVDD = 1.8V)

    • Support DDR up to 160 MHz (only for IOVDD = 1.8V)

  • SD card

    • Support SD 3.0

    • Support SDR up to 200MHz

  • SPI-NAND flash

    • Support SLC NAND only

    • Support up to 150Mz (only for 1.8V)

    • Support 1 or 2 planes 2k page-size dice

    • Support 1 plane 4k page-size dice

  • 8-bit NAND flash

    • Support 1.8V and 3.3V

    • Support 2k/4k/8 page-size dice

    • Support synchronous mode

  • SPI-NOR flash

    • Support 1/2/4-bit mode

    • Support 1.8V and 3.3V

    • Support up to 100Mz (only for 1.8V)

• In-system Programming for Flash Devices

  • eMMC, SPI-NAND, 8-bit NAND, and SPI-NOR

  • In-system programming through USB flash drives or SD cards

• Security

  • Support AES-128/192/256 encryption and decryption ECB, CBC, CTR mode

  • Support RSA

    • 256/512/1024/2048 bits encryption

    • modular exponentiation

  • Support HASH

    • SHA-2 256/512

    • SHA-3 224/256/384/512

    • MD5

  • GHASH for AES GCM mode

  • Support POLY 1305

  • Support Pseudo RNG

  • Support ARM TZC-400

  • Support secure boot

• SDIO

  • Support SD 3.0

  • Support transfer rate up to 104MB/s (UHS-1)

• Video and image codec

  • H.264/MVC, VP8 and JPEG encoding

  • H.264/SVC and JPEG decoding

  • Individual controllable power domain.

• USB3.1 (Gen. 1) Interface

  • Compliant to USB 3.1 Gen1 with DRD

  • Data rate up to 5Gbps

  • Integrated PHY

  • Support 4 sets of end-points (1 control and 3 data)

• USB2.0 Interface

  • Compliant to USB 2.0

  • Support OTG 1.0

  • Support High, Full and Low speeds

    • 4 in: 3 bulk/interrupt; 1 bulk/interrupt/isochronous

    • 4 out: bulk/interrupt; 1 bulk/interrupt/isochronous

• MIPI CSI RX

  • 1 MIPI-CSI2 RX 4D1C (1.5 Gbps per lane), support 4 virtual channel

  • 1 MIPI-CSI2 RX 2D1C (1.5 Gbps per lane), support 2 virtual channel

  • 2 MIPI-CSI2 RX 2D1C (1.5 Gbps per lane), support 2 virtual channel

    • Shared pins with CPIO (when CPIO disable, MIPI CSI RX enable)

    • 2 MIPI-CSI2 RX can be combined as 1 MIPI-CSI2 RX 4D1C, support 4 virtual channel

  • Max resolution: 2688x1944

• MIPI CSI/DSI TX

  • One MIPI TX output for either CSI or DSI

  • 4 lanes with 1.5Gbps per lane

  • DSI TX resolution up to 1920x1080

  • CSI TX resolution up to 3840x2880

• Audio Interfaces

  • One bidirectional I2S

  • Two unidirectional I2S

  • One 16-channel TDM

  • Configurable serial clock frequency

  • Support 16 bit audio format

  • Support both master and slave mode

  • Compliant with the IIS/PCM standard

• Ethernet Controller

  • Support 10/100/1000 Mbps data rate

  • Support RGMII and RMII interface (1.8V)

  • Support IEEE1588

• ADC

  • 12-bit SAR ADC with 4-channel

  • Sampling rate up to 1MHz

• PWM

  • Support 12 bits resolution

  • Support pre-scaling factor from 1 to 512

• Real-Time-Clock (RTC)

  • Independent Always-On power domain

  • 64 bits free-run timer with 32.768 kHz clock input

• SPI/I2C/UART

  • Up to seven UART interfaces

  • Up to six SPI interfaces (5 master, and 1 slave)

  • Up to ten I2C interfaces

• GPIO

  • Support total 106 GPIOs

  • Support software programmable driving strength for all GPIOs

  • Support 60 GPIOs with 1.8V/3.3V capability

    • 3 groups in AO-power domain

    • 2 groups in main-power domain

• Watchdog Timer

  • 32-bit counter

  • Up to 223 second

• Mailbox

  • For inter-processor communication between CA55 and CM4

• RTC

  • 32.768 kHz crystal

• Semaphore

  • Support read lock and write unlock

  • Support 16 channels

• Thermal Sensor

  • Placed at between CPU and NPU

  • Support two threshold temperatures (default disable)

    • Alarm threshold, interrupt to CPU

    • Shutdown threshold, for resetting all system

• Multi-Function Interface (MFI) and CPIO

  • Selectable proprietary CPIO and MIPI CSI-RX interfaces

  • CPIO interface

    • Supports 4 data lanes for both TX and RX, provides 1.0 GiB/s bandwidth

    • Support hardware auto calibration

    • Support hardware auto and/or software programmable SWAP and CROSSOVER modes

    • Support data swap

• Package: 15x15mm² FCCSP

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It's important to note that RX2 and RX3 share pins with the CPIO interface. Therefore, only one of RX2/RX3 or the CPIO interface can be active at any given time.

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