9. Physical Dimension

9.1. Outline Dimensions 176-pin LQFP

Recommended Reflow Parameter Value

Parameter	Reference	Green Package
Average temperature gradient in preheating	Rpreheat	1-2°C /sec
Soak time	tsoak	60-90 sec
Temperature gradient in soak/dryout	Rdryout	2-3°C /sec
Time above Tmp (Melting Point), 217°C	treflow	40-60 sec
Peak temperature in reflow	Tpeak	217°C+20°C(min.) to 30°C(max.)
Temperature gradient in cooling	Rcooling	2-4°C /sec

Note: 1. Sn/Ag/Cu are recommended for SMT application

2. Max. temperature for IC in SMT's process : <=260°C , time : <=10sec

Recommended Reflow Profile

Note: The recommended reflow profile can meet IPC/JEDEC J-STD-020 requirement.

Note:

1. Compliance with the EU RoHS Directive

2. Material Recycling: Cu 30%