10. Physical Dimension

Owned by Longson Huang
Last updated: Jun 25, 2019
2 min read

10.1. Outline Dimensions 176-pin LQFP

 



10.2. Recommended Reflow Profile

Recommended Reflow Parameter Value

 

Parameter

Reference

Green Package

Average temperature gradient in preheating

Rpreheat

1-2°C /sec

Soak time

tsoak

60-90 sec

Temperature gradient in soak/dryout

Rdryout

2-3°C /sec

Time above Tmp (Melting Point), 217°C

treflow

40-60 sec

Peak temperature in reflow

Tpeak

217°C+20°C(min.) to 30°C(max.)

Temperature gradient in cooling

Rcooling

2-4°C /sec

Note: 1. Sn/Ag/Cu are recommended for SMT application

2. Max. temperature for IC in SMT's process : <=260°C , time : <=10sec

 

Recommended Reflow Profile

 

 

Note: The recommended reflow profile can meet IPC/JEDEC J-STD-020 requirement.

 

Note:

1. Compliance with the EU RoHS Directive

2. Material Recycling: Cu 30%